TSS at North America TSMC 2025 Open Innovation Platform (OIP) Ecosystem Forum

On September 24, 2025, TSS attended TSMC North America OIP Ecosystem Forum at the Santa Clara Convention Center.

This year, the focus is again on AI. Last year, there were a lot of proposals and this year, many companies shared their technologies and results on how AI is improving the way that chips are designed and verified. This is especially significant for chip top level where there are large number of manufacturing design rules to be met. TSMC also shared their roadmap and their plans on the on-going development of new fabrication centers.

As per other years, we had a great time meeting with our partners and industry leaders, talking to our friends and customers throughout the event.

Once again, congratulations to all the TSMC OIP Partner of the Year Awards winners.

See you again next year, TSMC OIP!