We at TSS and OPENEDGES were invited to attend the TSMC 2023 OIP Ecosystem Forum in Santa Clara, where we had the opportunities to connect with other TSMC OIP partners, talk to vendors, customers, and friends in the industry. As a semiconductor IP design organization, this forum is one of the most important to attend. This year marks the 15th anniversary since the establishment of Open Innovation Platform.
One of the highlights of the forum surrounds the 3Dblox 2.0 open standard, where it enables early 3D design exploration capability, with the aim to boost design efficiency for 3DIC systems. For power and thermal feasibility studies, designers can utilize 3Dblox 2.0 to construct the holistic 3D view for the entire 3D system, providing key insights on design decisions.
At TSS, we would like to extend our thank you to imec.IC-link for inviting us to this event. We look forward to meeting up with you again at the next event!